SMT Assembly
Full automatic in - line system composed of following devices: PCB buffer, DEK ELA printer
TOPAZ X-II ASSEMBLEON pick and place machine, MG-1R ASSEMBLEON pick and place machine, ELEKTROVERT BRAVO 8105 reflow oven, PCB buffer
The whole system is interconnected by in-li conveyers
STANDALONE dispenzer CAMALOT 3800
Devices for automatic inspection: AOI MIRTEC MV-3L
Capacity of automatic line: 40 000 components per hour
Minimal pitch: 0,4 mm
Component package size 0201- BGA components
Single-sided and double-sided surface mount technology ( SMT ) assembly via soldering paste or SMT glue
Manual or automatic component placement on rigid or flexible PCBs
Reflowing or hardening via reflow ovens with conventional or infra - red heating
Special testing and repairing devices for SMT area
Precise monitoring and documenting of reflow temperature profiles in reflow ovens
THT Assembly
Manual placement and final assembly PCBs, manual and wave soldering, testing
Parts of system for automotive industry
Complete manufacturing of an electronic equipment
Building of special electrical and electronic assemblies ( VPS, BOX Building )
Testing and debugging of electronic assemblies and equipment
Electronics manufacturing services (EMS)
Engineering services (Design for manufacturing, Design for test )
Supply Chain Services ( Key supplier Partnership, Best BOM Comparsion )
NPI/Prototyping ( Dedicated materials management, Manufacturability assessment, Quick turn prototypes )
Assembly and Fulfillment ( Advanced high - level assembly, configuration management for “built to order” requirements, international shipment and logistic support )
Sustaining services ( Warranty depot service repair, Quality report and lot traceability )