SMT Assembly
- Full automatic in - line system composed of following devices: PCB buffer, DEK ELA printer
- TOPAZ X-II ASSEMBLEON pick and place machine, MG-1R ASSEMBLEON pick and place machine, ELEKTROVERT BRAVO 8105 reflow oven, PCB buffer
- The whole system is interconnected by in-li conveyers
- STANDALONE dispenzer CAMALOT 3800
- Devices for automatic inspection: AOI MIRTEC MV-3L
- Capacity of automatic line: 40 000 components per hour
- Minimal pitch: 0,4 mm
- Component package size 0201- BGA components
- Single-sided and double-sided surface mount technology ( SMT ) assembly via soldering paste or SMT glue
- Manual or automatic component placement on rigid or flexible PCBs
- Reflowing or hardening via reflow ovens with conventional or infra - red heating
- Special testing and repairing devices for SMT area
- Precise monitoring and documenting of reflow temperature profiles in reflow ovens
THT Assembly
- Manual placement and final assembly PCBs, manual and wave soldering, testing
- Parts of system for automotive industry
- Complete manufacturing of an electronic equipment
- Building of special electrical and electronic assemblies ( VPS, BOX Building )
- Testing and debugging of electronic assemblies and equipment
Electronics manufacturing services (EMS)
- Engineering services (Design for manufacturing, Design for test )
- Supply Chain Services ( Key supplier Partnership, Best BOM Comparsion )
- NPI/Prototyping ( Dedicated materials management, Manufacturability assessment, Quick turn prototypes )
- Assembly and Fulfillment ( Advanced high - level assembly, configuration management for “built to order” requirements, international shipment and logistic support )
- Sustaining services ( Warranty depot service repair, Quality report and lot traceability )
